YINCAE SMT158 SERIES
One Part/Underfill Material/Rrapid curing/Fast flowing
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Description
YINCAE SMT158 Series Application description： A device that requires a specification reliability such as BGA FLIPCHIP.
Additional information
| Brand | YINCAE |
|---|---|
| Manufacturer SKU | |
| Application | Die Adhesive |
| Market application | Semiconductor |
| Mix Ratio by Weight | One Part |
| Material | EPOXY |
| Color/Appearance | Black, White |
| Viscosity (mPa.s) | 35,000-80,000 |
| C.T.E. (ppm/℃) | α1 = 35, α2 = 142 |
| Cure Condition | 15 mins @ 150℃, in line curing or reflow |
| Working Time (@25℃) | 8 hrs |
| Thermal Conductivity (W /mK) |
More Information
If you want to know more about the use of the product or related certification, such as UL,RoHS,REACH,European Union Regulations, Please make use of the inquiry form or telephone.
