SIL-MORE EOX-BAB-EM2R50

5:1/Thermal conductive potting /Low curing shrinkage

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Additional information
Brand

SIL-MORE

Manufacturer SKU
Application

Encapsulants / Potting

Market application

Automotive Electronics, Consumer Electronics, General Industry

Mix Ratio by Weight

5:1

Material

EPOXY

Color/Appearance

Black

Viscosity (mPa.s)

7,500 ~ 8,500

Working Time (@25℃)

60 mins

Cure Condition

≦12 hrs @ 25℃, ≦5 hrs @ 50℃

Certification

UL 94 V-0

Specific Gravity

2

Hardness (Shore)

86 (D)

Glass Transition Temperature

2.5(Thermal Conductivity (W/m∙k)

Dielectric Strength (KV/mm )

≧10

Volume Resistivity (ohm*cm)

> 1013

If you want to know more about the use of the product or related certification, such as UL,RoHS,REACH,European Union Regulations, Please make use of the inquiry form or telephone.

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