SILMORE EPO-SIL 6824 FLIP-CHIP ENCAPSULANT EPOXY RESIN BLACK,30G-SYR

One Part/Fast curing at low temperature/Good flow and permeability

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Description

Application description:BGA,CSP flip-chip package coating epoxy resin

Brand

SIL-MORE

Manufacturer SKU

N/A

Application

Adhesive / Sealant

Market application

Consumer Products

Material

EPOXY

Mix Ratio by Weight

One Part

Color/Appearance

Black

Viscosity (mPa.s)

3,040

Tack-Free Time

N/A

Cure Condition

15 mins@100℃, 30 mins@80℃

Temperature Stability (℃)

-40℃~100℃

Specific Gravity

1.218

Hardness (Shore)

77 (D)

Tensile Strength (psi)

58,000

Dielectric Strength (KV/mm )

12

Volume Resistivity (ohm*cm)

4.5+E15

If you want to know more about the use of the product or related certification, such as UL,RoHS,REACH,European Union Regulations, Please make use of the inquiry form or telephone.

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